Devcon

Devcon 5 Minute Epoxy Gels, 50 mL, Dev-Pak, Amber, 12/CS

SKU:
OR-230-14265
Weight:
2.28 LBS
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$402.57

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$402.57
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Hazardous Material - Product can only ship within the contiguous US. Must ship ground - cannot ship Next Day or 2nd Day Air.

  • Thixotropic, nonmigrating gel adhesive with excellent gap filling properties
  • High tensile strength
  • Good solvent resistance
  • Non-sagging adhesive
  • Fills gaps to .25 inch
  • Fast curing for bond tags on machinery and equipment

Other Details

Shipping:
Calculated at Checkout
Adhesive Tensile Shear:
2,500 psi
Chemical Compound:
Epoxy
Color:
Opaque
Dielectric Strength:
440 V/mil
Fix Cure Time @ Temp.:
1 h @ 75 °F
Full Cure Time @ Temp.:
16 h @ 75 °F
Packing Type:
Dev-Pak
Resistance:
Kerosene, Sulfuric Acid-10%, Toluene, Hydrochloric Acid 3%
Container Size:
50 mL
Applicable Materials:
Wood, Most Metals, Ceramic, Fabric, Concrete, Steel, Aluminum, Copper, Ferrites
Gap Fill:
1/4 in
Viscocity:
150,000 cP
Weight:
0.2 lb
Hardness:
80 Shore D
Temp Range (Max):
200 °F
Temp Range (Min):
-40 °F
Package Quantity:
12
Product Type:
Epoxy
Working Time:
4 - 7 min
Applications:
Multi-Purpose

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