Devcon

Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw, 1/EA

SKU:
OR-230-14315
Weight:
0.18 LBS
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Special Order - This is a special order item and cannot be canceled or returned.

Hazardous Material - Product can only ship within the contiguous US. Must ship ground - cannot ship Next Day or 2nd Day Air.

  • High-performance, gap-filling thixotropic paste for structural bonding applications
  • Superior toughness, impact and chemical resistant
  • Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
  • Excellent gap fill.

Other Details

UPC:
78143143151
Adhesive Tensile Shear:
3,200 psi
Base Type:
Epoxy
Chemical Compound:
Epoxy
Color:
Straw
Dielectric Strength:
490 V/mil
Fix Cure Time @ Temp.:
6 h @ 72 °F
Full Cure Time @ Temp.:
7 d @ 72 °F
Material:
Thixotropic Paste
Odor/Scent:
Low
Packing Type:
Dev-Pak
Physical Form:
Solid
Resistance:
Chlorinated Solvents, Kerosene, Moisture, Water, Weather
Container Size:
50 mL
Applicable Materials:
Aluminum, Brass, Copper, Galvanized Steel, Most Metals, Steel
Elongation:
25%
Height:
3 1/4 in
Length:
7 1/4"
Tensile Strength:
3,200 psi
Viscocity:
105,000 cP
Width:
6 in
Hardness:
78 Shore D
Mix Ratio Type:
2:01
Temp Range (Max):
250 °F
Temp Range (Min):
-67 °F
Package Quantity:
1
Product Type:
Epoxy
Working Time:
65 min
Applications:
Multi-Purpose

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