Devcon

Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw, 1/EA

SKU:
OR-230-14315
Weight:
0.18 LBS
(No reviews yet) Write a Review
Email for Pricing
Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw, 1/EA

Note: The image displayed is a representation of the product. Product dimensions, finish, head type, and thread length may differ from picture. Products are guaranteed to meet the specification to which they are manufactured. Please email us with any questions.

Request A Quote
Add to Wish List

Special Order - This is a special order item and cannot be canceled or returned.

Hazardous Material - Product can only ship within the contiguous US. Must ship ground - cannot ship Next Day or 2nd Day Air.

  • High-performance, gap-filling thixotropic paste for structural bonding applications
  • Superior toughness, impact and chemical resistant
  • Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
  • Excellent gap fill.

Other Details

UPC:
78143143151
Adhesive Tensile Shear:
3,200 psi
Base Type:
Epoxy
Chemical Compound:
Epoxy
Color:
Straw
Dielectric Strength:
490 V/mil
Fix Cure Time @ Temp.:
6 h @ 72 °F
Full Cure Time @ Temp.:
7 d @ 72 °F
Material:
Thixotropic Paste
Odor/Scent:
Low
Packing Type:
Dev-Pak
Physical Form:
Solid
Resistance:
Chlorinated Solvents, Kerosene, Moisture, Water, Weather
Container Size:
50 mL
Applicable Materials:
Aluminum, Brass, Copper, Galvanized Steel, Most Metals, Steel
Elongation:
25%
Height:
3 1/4 in
Length:
7 1/4"
Tensile Strength:
3,200 psi
Viscocity:
105,000 cP
Width:
6 in
Hardness:
78 Shore D
Mix Ratio Type:
2:01
Temp Range (Max):
250 °F
Temp Range (Min):
-67 °F
Package Quantity:
1
Product Type:
Epoxy
Working Time:
65 min
Applications:
Multi-Purpose

Related Products